| Translated title of the contribution | PCB drop test lifetime assessment based on simulations and cyclic bend tests |
|---|---|
| Original language | English |
| Pages (from-to) | 774-781 |
| Journal | Microelectronics Reliability |
| Volume | 53 |
| Publication status | Published - 2013 |
PCB drop test lifetime assessment based on simulations and cyclic bend tests
Peter Fuchs, Gerald Pinter, Zoltan Major
Research output: Contribution to journal › Article › Research › peer-review
11
Citations
(Scopus)