@inproceedings{a6a52a013aa242a18dd7dd9f2b9c0f57,
title = "Prediction of Curing Induced Residual Stresses in Polymeric Encapsulation Materials for Microelectronics",
author = "Christian Schipfer and Mario Gschwandl and Peter Fuchs and Thomas Antretter and Michael Feuchter and Matthias Morak and Qi Tao and Angelika Schingale",
note = "Publisher Copyright: {\textcopyright} 2021 IEEE.; 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021 ; Conference date: 19-04-2021 Through 21-04-2021",
year = "2021",
month = apr,
day = "19",
doi = "10.1109/EuroSimE52062.2021.9410855",
language = "English",
isbn = "9781665413732",
series = "2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021",
publisher = "Institute of Electrical and Electronics Engineers",
booktitle = "2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021",
address = "United States",
}