Simulation of the 'Single Via Thermal Cycle Test' – Finite Element Modelling of PCBs under thermal loads

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Translated title of the contribution	Simulation of the 'Single Via Thermal Cycle Test' – Finite Element Modelling of PCBs under thermal loads
Original language	English
Title of host publication	13th Youth Symposium on Experimental Solid Mechanics
Pages	29-32
Publication status	Published - 2014

Cite this

@inproceedings{811087ef38d84b00aef59c8c585565a2,

title = "Simulation of the 'Single Via Thermal Cycle Test' – Finite Element Modelling of PCBs under thermal loads",

author = "Klaus Fellner and Peter Fuchs and Gerald Pinter",

year = "2014",

language = "English",

pages = "29--32",

booktitle = "13th Youth Symposium on Experimental Solid Mechanics",

}