Strength and fracture analysis of silicon chips to be embedded into printed circuit boards

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)
Original languageEnglish
Title of host publication18th European Conference on Fracture: Fracture of Materials and Structures from Micro to Macro Scale
Publication statusPublished - 2010
Event18th European Conference on Fracture: Fracture of Materials and Structures from Micro to Macro Scale, ECF 2010 - Dresden, Germany
Duration: 30 Aug 20103 Sept 2010

Conference

Conference18th European Conference on Fracture: Fracture of Materials and Structures from Micro to Macro Scale, ECF 2010
Country/TerritoryGermany
CityDresden
Period30/08/103/09/10

Keywords

  • Biaxial strength
  • Brittle fracture
  • Failure analysis
  • Functional applications
  • PCB
  • Silicon
  • Weibull statistics

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