Stress and Deflection Development During Die Embedding into Printed Circuit Boards

Katerina Macurova; Paul Angerer; Raul Bermejo; Martin Pletz; Ronald Schöngrundner; Thomas Antretter; Thomas Krivec; Mike Morianz; Michel Brizoux; A. Lecavelier

doi:http://dx.doi.org/10.1016/j.matpr.2015.09.003

Stress and Deflection Development During Die Embedding into Printed Circuit Boards

Katerina Macurova, Paul Angerer, Raul Bermejo, Martin Pletz, Ronald Schöngrundner, Thomas Antretter, Thomas Krivec, Mike Morianz, Michel Brizoux, A. Lecavelier

Materials Center Leoben Forschungs GmbH

Research output: Contribution to journal › Article › Research › peer-review

4 Citations (Scopus)

Original language	Undefined/Unknown
Pages (from-to)	4196-4205
Number of pages	10
Journal	Materials Today: Proceedings
Volume	2
Issue number	2
DOIs	https://doi.org/10.1016/j.matpr.2015.09.003
Publication status	Published - 2015

Access to Document

http://dx.doi.org/10.1016/j.matpr.2015.09.003

Cite this

@article{c864fc045f0e4659ada9ae50274e6d27,

title = "Stress and Deflection Development During Die Embedding into Printed Circuit Boards",

author = "Katerina Macurova and Paul Angerer and Raul Bermejo and Martin Pletz and Ronald Sch{\"o}ngrundner and Thomas Antretter and Thomas Krivec and Mike Morianz and Michel Brizoux and A. Lecavelier",

year = "2015",

doi = "http://dx.doi.org/10.1016/j.matpr.2015.09.003",

language = "Undefined/Unknown",

volume = "2",

pages = "4196--4205",

journal = "Materials Today: Proceedings",

publisher = "Elsevier",

number = "2",

}

TY - JOUR

T1 - Stress and Deflection Development During Die Embedding into Printed Circuit Boards

AU - Macurova, Katerina

AU - Angerer, Paul

AU - Bermejo, Raul

AU - Pletz, Martin

AU - Schöngrundner, Ronald

AU - Antretter, Thomas

AU - Krivec, Thomas

AU - Morianz, Mike

AU - Brizoux, Michel

AU - Lecavelier, A.

PY - 2015

Y1 - 2015

U2 - http://dx.doi.org/10.1016/j.matpr.2015.09.003

DO - http://dx.doi.org/10.1016/j.matpr.2015.09.003

M3 - Article

VL - 2

SP - 4196

EP - 4205

JO - Materials Today: Proceedings

JF - Materials Today: Proceedings

IS - 2

ER -