Stress and Deflection Development During Die Embedding into Printed Circuit Boards

Katerina Macurova; Paul Angerer; Raul Bermejo; Martin Pletz; Ronald Schöngrundner; Thomas Antretter; Thomas Krivec; Mike Morianz; Michel Brizoux; A. Lecavelier

doi:10.1016/j.matpr.2015.09.003

Stress and Deflection Development During Die Embedding into Printed Circuit Boards

Katerina Macurova
, Paul Angerer
, Raul Bermejo
, Martin Pletz
, Ronald Schöngrundner
, Thomas Antretter
, Thomas Krivec
, Mike Morianz
, Michel Brizoux
, A. Lecavelier

Materials Center Leoben Forschungs GmbH

Research output: Contribution to journal › Article › Research › peer-review

4 Citations (Scopus)

Original language	Undefined/Unknown
Pages (from-to)	4196-4205
Number of pages	10
Journal	Materials Today: Proceedings
Volume	2
Issue number	2
DOIs	https://doi.org/10.1016/j.matpr.2015.09.003
Publication status	Published - 2015

Access to Document

10.1016/j.matpr.2015.09.003

Cite this

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title = "Stress and Deflection Development During Die Embedding into Printed Circuit Boards",

author = "Katerina Macurova and Paul Angerer and Raul Bermejo and Martin Pletz and Ronald Sch{\"o}ngrundner and Thomas Antretter and Thomas Krivec and Mike Morianz and Michel Brizoux and A. Lecavelier",

year = "2015",

doi = "10.1016/j.matpr.2015.09.003",

language = "Undefined/Unknown",

volume = "2",

pages = "4196--4205",

journal = "Materials Today: Proceedings",

publisher = "Elsevier",

number = "2",

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TY - JOUR

T1 - Stress and Deflection Development During Die Embedding into Printed Circuit Boards

AU - Macurova, Katerina

AU - Angerer, Paul

AU - Bermejo, Raul

AU - Pletz, Martin

AU - Schöngrundner, Ronald

AU - Antretter, Thomas

AU - Krivec, Thomas

AU - Morianz, Mike

AU - Brizoux, Michel

AU - Lecavelier, A.

PY - 2015

Y1 - 2015

U2 - 10.1016/j.matpr.2015.09.003

DO - 10.1016/j.matpr.2015.09.003

M3 - Article

VL - 2

SP - 4196

EP - 4205

JO - Materials Today: Proceedings

JF - Materials Today: Proceedings

IS - 2

ER -