@article{2da96328a16849dead6b944aef86e2a1,
title = "Stress, Sheet Resistance, and Microstructure Evolution of Electroplated Cu Films During Self-Annealing",
author = "R. Huang and W. Robl and H. Ceric and T. Detzel and Gerhard Dehm",
year = "2010",
doi = "10.1109/TDMR.2009.2032768",
language = "English",
volume = "10",
pages = "47--54",
journal = "IEEE transactions on device and materials reliability",
issn = "1530-4388",
publisher = "Institute of Electrical and Electronics Engineers",
number = "1",
}