The effect of bending loading conditions on the reliability of inkjet printed and evaporated silver metallization on polymer substrates

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18 Citations (Scopus)

Original language	English
Journal	Microelectronics Reliability
DOIs	https://doi.org/doi:10.1016/j.microrel.2015.10.007
Publication status	Published - 2016

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@article{970cffb8dc9c4fb087bf13a4bfebd251,

title = "The effect of bending loading conditions on the reliability of inkjet printed and evaporated silver metallization on polymer substrates",

author = "Oleksandr Glushko and Megan Cordill and A. Klug and E.J.W. List-Kratochvil",

year = "2016",

doi = "doi:10.1016/j.microrel.2015.10.007",

language = "English",

journal = "Microelectronics Reliability",

issn = "0026-2714",

publisher = "Elsevier Ltd",

}

TY - JOUR

T1 - The effect of bending loading conditions on the reliability of inkjet printed and evaporated silver metallization on polymer substrates

AU - Glushko, Oleksandr

AU - Cordill, Megan

AU - Klug, A.

AU - List-Kratochvil, E.J.W.

PY - 2016

Y1 - 2016

U2 - doi:10.1016/j.microrel.2015.10.007

DO - doi:10.1016/j.microrel.2015.10.007

M3 - Article

SN - 0026-2714

JO - Microelectronics Reliability

JF - Microelectronics Reliability

ER -