Thermal Stresses and Microstructure of Tungsten Films on Copper

Marianne Kapp, Klaus J. Martinschitz, Jozef Keckes, J.M. Lackner, Ivo Zizak, Gerhard Dehm

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Translated title of the contribution	Thermal Stresses and Microstructure of Tungsten Films on Copper
Original language	English
Pages (from-to)	273-277
Journal	Berg- und hüttenmännische Monatshefte : BHM
Volume	517
Publication status	Published - 2008

Cite this

@article{6a58fe23032b4b3ca766c777fe00d395,

title = "Thermal Stresses and Microstructure of Tungsten Films on Copper",

author = "Marianne Kapp and Martinschitz, {Klaus J.} and Jozef Keckes and J.M. Lackner and Ivo Zizak and Gerhard Dehm",

year = "2008",

language = "English",

volume = "517",

pages = "273--277",

journal = "Berg- und h{\"u}ttenm{\"a}nnische Monatshefte : BHM",

issn = "0005-8912",

publisher = "Springer Wien",

}

TY - JOUR

T1 - Thermal Stresses and Microstructure of Tungsten Films on Copper

AU - Kapp, Marianne

AU - Martinschitz, Klaus J.

AU - Keckes, Jozef

AU - Lackner, J.M.

AU - Zizak, Ivo

AU - Dehm, Gerhard

PY - 2008

Y1 - 2008

M3 - Article

SN - 0005-8912

VL - 517

SP - 273

EP - 277

JO - Berg- und hüttenmännische Monatshefte : BHM

JF - Berg- und hüttenmännische Monatshefte : BHM

ER -