Thermographic investigations of metal inclusions in 3D printed samples

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Original languageEnglish
Title of host publicationThermosense: Thermal Infrared Applications XXXIX
PublisherSPIE
Volume10214
ISBN (Electronic)9781510609297
DOIs
Publication statusPublished - 2017
EventThermosense: Thermal Infrared Applications XXXIX 2017 - Anaheim, United States
Duration: 10 Apr 201713 Apr 2017

Conference

ConferenceThermosense: Thermal Infrared Applications XXXIX 2017
Country/TerritoryUnited States
CityAnaheim
Period10/04/1713/04/17

Keywords

  • 3D printing
  • Flash thermography
  • metal inclusion
  • subsurface defect
  • thermal quadrupoles

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