Thermomechanical and Electrical Material Characterization for a DLP Printing Process Simulation of Electrically Conductive Parts

A. Thalhamer; E. Rossegger; S. Hasil; K. Hrbinic; V. Feigl; M. Pfost; P. Fuchs

doi:10.1109/EuroSimE56861.2023.10100754

Thermomechanical and Electrical Material Characterization for a DLP Printing Process Simulation of Electrically Conductive Parts

A. Thalhamer, E. Rossegger, S. Hasil, K. Hrbinic, V. Feigl, M. Pfost, P. Fuchs

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Original language	English
Title of host publication	2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023
Publisher	Institute of Electrical and Electronics Engineers
ISBN (Electronic)	9798350345971
DOIs	https://doi.org/10.1109/EuroSimE56861.2023.10100754
Publication status	Published - 2023
Event	24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023 - Graz, Austria Duration: 16 Apr 2023 → 19 Apr 2023

Publication series

Name	2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023

Conference

Conference	24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023
Country/Territory	Austria
City	Graz
Period	16/04/23 → 19/04/23

Bibliographical note

Publisher Copyright:
© 2023 IEEE.

Access to Document

10.1109/EuroSimE56861.2023.10100754

Cite this

Thalhamer, A., Rossegger, E., Hasil, S., Hrbinic, K., Feigl, V., Pfost, M., & Fuchs, P. (2023). Thermomechanical and Electrical Material Characterization for a DLP Printing Process Simulation of Electrically Conductive Parts. In 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023 (2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023). Institute of Electrical and Electronics Engineers. https://doi.org/10.1109/EuroSimE56861.2023.10100754

Thalhamer, A. ; Rossegger, E. ; Hasil, S. et al. / Thermomechanical and Electrical Material Characterization for a DLP Printing Process Simulation of Electrically Conductive Parts. 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023. Institute of Electrical and Electronics Engineers, 2023. (2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023).

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author = "A. Thalhamer and E. Rossegger and S. Hasil and K. Hrbinic and V. Feigl and M. Pfost and P. Fuchs",

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Thalhamer, A, Rossegger, E, Hasil, S, Hrbinic, K, Feigl, V, Pfost, M & Fuchs, P 2023, Thermomechanical and Electrical Material Characterization for a DLP Printing Process Simulation of Electrically Conductive Parts. in 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023. 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023, Institute of Electrical and Electronics Engineers, 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023, Graz, Austria, 16/04/23. https://doi.org/10.1109/EuroSimE56861.2023.10100754

Thermomechanical and Electrical Material Characterization for a DLP Printing Process Simulation of Electrically Conductive Parts. / Thalhamer, A.; Rossegger, E.; Hasil, S. et al.
2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023. Institute of Electrical and Electronics Engineers, 2023. (2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

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T1 - Thermomechanical and Electrical Material Characterization for a DLP Printing Process Simulation of Electrically Conductive Parts

AU - Thalhamer, A.

AU - Rossegger, E.

AU - Hasil, S.

AU - Hrbinic, K.

AU - Feigl, V.

AU - Pfost, M.

AU - Fuchs, P.

PY - 2023

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U2 - 10.1109/EuroSimE56861.2023.10100754

DO - 10.1109/EuroSimE56861.2023.10100754

M3 - Conference contribution

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T3 - 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023

BT - 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023

PB - Institute of Electrical and Electronics Engineers

T2 - 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023

Y2 - 16 April 2023 through 19 April 2023

ER -

Thalhamer A, Rossegger E, Hasil S, Hrbinic K, Feigl V, Pfost M et al. Thermomechanical and Electrical Material Characterization for a DLP Printing Process Simulation of Electrically Conductive Parts. In 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023. Institute of Electrical and Electronics Engineers. 2023. (2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023). doi: 10.1109/EuroSimE56861.2023.10100754

Thermomechanical and Electrical Material Characterization for a DLP Printing Process Simulation of Electrically Conductive Parts

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