Thin Film Adhesion of Flexible Electronics Influenced by Interlayers

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9 Citations (Scopus)

Original language	English
Article number	1600665
Number of pages	7
Journal	Advanced engineering materials
Volume	19.2017
Issue number	4
DOIs	https://doi.org/10.1002/adem.201600665
Publication status	Published - 2017

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@article{d6986d8799cb4bb694f477268f5f58c3,

title = "Thin Film Adhesion of Flexible Electronics Influenced by Interlayers",

author = "Andreas Kleinbichler and Mattias Bartosik and Bernhard V{\"o}lker and Megan Cordill",

year = "2017",

doi = "10.1002/adem.201600665",

language = "English",

volume = "19.2017",

journal = " Advanced engineering materials",

issn = "1438-1656",

publisher = "Wiley-VCH ",

number = "4",

}

TY - JOUR

T1 - Thin Film Adhesion of Flexible Electronics Influenced by Interlayers

AU - Kleinbichler, Andreas

AU - Bartosik, Mattias

AU - Völker, Bernhard

AU - Cordill, Megan

PY - 2017

Y1 - 2017

UR - https://www.scopus.com/pages/publications/85006699583

U2 - 10.1002/adem.201600665

DO - 10.1002/adem.201600665

M3 - Article

AN - SCOPUS:85006699583

SN - 1438-1656

VL - 19.2017

JO - Advanced engineering materials

JF - Advanced engineering materials

IS - 4

M1 - 1600665

ER -