TiN diffusion barrier failure by the formation of Cu3Si investigated by electron microscopy and atom probe tomography

Research output: Contribution to journalArticleResearchpeer-review

13 Citations (Scopus)
Original languageEnglish
Article number022202
Pages (from-to)1-8
Number of pages8
JournalJournal of Vacuum Science and Technology B, JVSTB
Volume34.2016
Issue number2
DOIs
Publication statusPublished - 19 Feb 2016

Cite this