| Translated title of the contribution | Wavelet Analysis for Structure-Borne Sound Generating Sensor in Injection Molding |
|---|---|
| Original language | English |
| Title of host publication | 2013 International Conference on Applied Electronics |
| Pages | 233-236 |
| Publication status | Published - 2013 |
Cite this
- APA
- Author
- BIBTEX
- Harvard
- Standard
- RIS
- Vancouver