Neuester Forschungsoutput

• Adhesion evaluation of thin films to dielectrics in multilayer stacks: A comparison of four-point bending and stressed overlayer technique.

  Publikationen: Beitrag in Fachzeitschrift › Artikel › Forschung › (peer-reviewed)

• Improved electro-mechanical reliability of flexible systems with alloyed Mo-Ta adhesion layers

  Publikationen: Beitrag in Fachzeitschrift › Artikel › Forschung › (peer-reviewed)

• Microstructural effects on the interfacial adhesion of nanometer- thick Cu films on glass substrates: Implications for microelectronic devices

  Publikationen: Beitrag in Fachzeitschrift › Artikel › Forschung › (peer-reviewed)