Neuester Forschungsoutput

• Numerical analysis of the influence of polymeric materials on a MEMS package performance under humidity and temperature loads

  Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband

• Model Free Kinetics coupled with Finite Element Method for curing simulation of thermosetting epoxy resins

  Publikationen: Beitrag in Fachzeitschrift › Artikel › Forschung › (peer-reviewed)

• Press Cycle Time Reduction of A Reinforced Epoxy Resin and the Influence On Its Mechanical/Thermal Properties

  Publikationen: Thesis / Studienabschlussarbeit › Dissertation