Microstructural Effects on the Interfacial Adhesion of Nanometer-Thick Cu Films on Glass Substrates: Implications for Microelectronic Devices

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Microstructural Effects on the Interfacial Adhesion of Nanometer-Thick Cu Films on Glass Substrates : Implications for Microelectronic Devices. / Lassnig, Alice; Terziyska, Velislava L.; Zalesak, Jakub; Jörg, Tanja; Toebbens, Daniel M.; Griesser, Thomas; Mitterer, Christian; Pippan, Reinhard; Cordill, Megan J.

in: ACS Applied Nano Materials, Jahrgang 4.2021, Nr. 1, 28.12.2020, S. 61-70.

Publikationen: Beitrag in FachzeitschriftArtikelForschung(peer-reviewed)

Bibtex - Download

@article{cfb13d8e5c454299acc2ac1ffabbf3d5,
title = "Microstructural Effects on the Interfacial Adhesion of Nanometer-Thick Cu Films on Glass Substrates: Implications for Microelectronic Devices",
keywords = "brittle-ductile interface, film microstructure, nanosized Cu films, spontaneous buckles, thin film adhesion",
author = "Alice Lassnig and Terziyska, {Velislava L.} and Jakub Zalesak and Tanja J{\"o}rg and Toebbens, {Daniel M.} and Thomas Griesser and Christian Mitterer and Reinhard Pippan and Cordill, {Megan J.}",
note = "Publisher Copyright: {\textcopyright} 2020 American Chemical Society.",
year = "2020",
month = dec,
day = "28",
doi = "10.1021/acsanm.0c02182",
language = "English",
volume = "4.2021",
pages = "61--70",
journal = "ACS Applied Nano Materials",
issn = "2574-0970",
publisher = "American Chemical Society",
number = "1",

}

RIS (suitable for import to EndNote) - Download

TY - JOUR

T1 - Microstructural Effects on the Interfacial Adhesion of Nanometer-Thick Cu Films on Glass Substrates

T2 - Implications for Microelectronic Devices

AU - Lassnig, Alice

AU - Terziyska, Velislava L.

AU - Zalesak, Jakub

AU - Jörg, Tanja

AU - Toebbens, Daniel M.

AU - Griesser, Thomas

AU - Mitterer, Christian

AU - Pippan, Reinhard

AU - Cordill, Megan J.

N1 - Publisher Copyright: © 2020 American Chemical Society.

PY - 2020/12/28

Y1 - 2020/12/28

KW - brittle-ductile interface

KW - film microstructure

KW - nanosized Cu films

KW - spontaneous buckles

KW - thin film adhesion

UR - http://www.scopus.com/inward/record.url?scp=85099212374&partnerID=8YFLogxK

U2 - 10.1021/acsanm.0c02182

DO - 10.1021/acsanm.0c02182

M3 - Article

AN - SCOPUS:85099212374

VL - 4.2021

SP - 61

EP - 70

JO - ACS Applied Nano Materials

JF - ACS Applied Nano Materials

SN - 2574-0970

IS - 1

ER -