Multi-physics simulation of the component attachment within embedding process

Publikationen: Beitrag in Buch/Bericht/KonferenzbandBeitrag in Konferenzband

Autoren

Externe Organisationseinheiten

  • Materials Center Leoben Forschungs GmbH

Details

OriginalspracheEnglisch
Titel14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013
Herausgeber (Verlag)Institute of Electrical and Electronics Engineers Inc.
Seiten1-6
Seitenumfang6
ISBN (Print)978-1-4673-6138-5
DOIs
StatusVeröffentlicht - 1 Apr 2013
Veranstaltung14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - Wroclaw, Polen
Dauer: 15 Apr 201317 Apr 2013

Konferenz

Konferenz14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems
KurztitelEuroSimE 2013
LandPolen
OrtWroclaw
Zeitraum15/04/1317/04/13