Prediction of Curing Induced Residual Stresses in Polymeric Encapsulation Materials for Microelectronics

Publikationen: Beitrag in Buch/Bericht/KonferenzbandBeitrag in Konferenzband

Externe Organisationseinheiten

  • Polymer Competence Center Leoben GmbH
  • Austria Technologie Systemtechnik Aktiengesellschaft
  • Vitesco Technologies

Details

OriginalspracheEnglisch
Titel2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021
Herausgeber (Verlag)Institute of Electrical and Electronics Engineers
ISBN (elektronisch)9781665413732
ISBN (Print)9781665413732
DOIs
StatusVeröffentlicht - 19 Apr 2021
Veranstaltung22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021 - St. Julian, Malta
Dauer: 19 Apr 202121 Apr 2021

Publikationsreihe

Name2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021

Konferenz

Konferenz22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021
Land/GebietMalta
OrtSt. Julian
Zeitraum19/04/2121/04/21