System Identification under General Norms for Linear Parameter Varying State-Space Systems via Sparse Matrix Methods

Harker, M. & Rath, G., 2022, 2022 IEEE/SICE International Symposium on System Integration, SII 2022. Institute of Electrical and Electronics Engineers, S. 317-322 6 S. (2022 IEEE/SICE International Symposium on System Integration, SII 2022).

Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband

Decomposition of a Periodic Perturbed Signal with Unknown Perturbation Frequency by the Method of Variable Projection

Handler, J., Ninevski, D. & O'Leary, P., 20 Dez 2021, 2021 7th International Conference on Mechanical Engineering and Automation ICMEAS 2021. Institute of Electrical and Electronics Engineers

Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband

A probabilistic approach for complete coverage path planning with low-cost systems

Rottmann, N., Denz, R., Bruder, R. & Rueckert, E., Aug 2021, 2021 10th European Conference on Mobile Robots, ECMR 2021 - Proceedings. Institute of Electrical and Electronics Engineers, (2021 10th European Conference on Mobile Robots, ECMR 2021 - Proceedings).

Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband

Investigating the influence of surface hardness and energy on the perceived stickiness of polymer coatings.

Griesser, M., Ules, T., Schlogl, S. & Gruber, D. P., 6 Jul 2021, 2021 IEEE World Haptics Conference, WHC 2021. Institute of Electrical and Electronics Engineers, S. 1148 1 S. (2021 IEEE World Haptics Conference, WHC 2021).

Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband

Instrumentation of a Roving Inspection Test Rig with Surface Geometry Measurement of Fiber Bundles

Lehner, S., Neunkirchen, S., Fauster, E. & O'Leary, P., 29 Jun 2021, 2021 IEEE International Instrumentation and Measurement Technology Conference (I2MTC) Proceedings. IEEE Xplore (online): Institute of Electrical and Electronics Engineers

Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband

Development and Hardware-in-the-Loop Simulation of an Air Purifier Automatic Control System

Babunski, D., Zaev, E., Poposki, F., Koleva, R. & Rath, G., 7 Jun 2021, 2021 10th Mediterranean Conference on Embedded Computing, MECO 2021. Institute of Electrical and Electronics Engineers, 9460141. (2021 10th Mediterranean Conference on Embedded Computing, MECO 2021).

Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband

Hardware-in-the-loop for Simulation and Control of Greenhouse Climate

Zaev, E., Babunski, D., Jovanov, A., Rath, G. & Payr, M. P., 7 Jun 2021, 2021 10th Mediterranean Conference on Embedded Computing, MECO 2021. Budva: Institute of Electrical and Electronics Engineers, 9460206. (2021 10th Mediterranean Conference on Embedded Computing, MECO 2021).

Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband

Estimating Parameters of a Sine Wave by the Method of Variable Projection

O'Leary, P. & Ninevski, D., 17 Mai 2021, I2MTC 2021 - IEEE International Instrumentation and Measurement Technology Conference, Proceedings. Institute of Electrical and Electronics Engineers, 9459842. (Conference Record - IEEE Instrumentation and Measurement Technology Conference; Band 2021-May).

Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband

Electro-Thermo-Mechanical Reliability Assessment of Arbitrary Power Electronics

Gschwandl, M., Pfost, M., Antretter, T., Fuchs, P. F., Mitev, I., Tao, Q. & Schingale, A., 19 Apr 2021, 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021. Institute of Electrical and Electronics Engineers, 9410862. (2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021).

Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband

Prediction of Curing Induced Residual Stresses in Polymeric Encapsulation Materials for Microelectronics

Schipfer, C., Gschwandl, M., Fuchs, P., Antretter, T., Feuchter, M., Morak, M., Tao, Q. & Schingale, A., 19 Apr 2021, 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021. Institute of Electrical and Electronics Engineers, 9410855. (2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021).

Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband