Journal of Microelectronics and Electronic Packaging, 1551-4897

Journal

ISSNs1551-4897

Research output

  1. 2016
  2. Published
  3. 2015
  4. Published

    Comparison of Different Methods for Stress and Deflection Analysis in Embedded die Packages during the Assembly Process

    Macurova, K., Bermejo, R., Pletz, M., Schöngrundner, R. & Antretter, T., 2015, In : Journal of Microelectronics and Electronic Packaging. 12, p. 80-85

    Research output: Contribution to journalArticleResearchpeer-review