Microelectronic engineering, 0167-9317

Journal

ISSNs0167-9317

Research output

  1. 2017
  2. Published

    Accelerated thermo-mechanical fatigue of copper metallizations studied by pulsed laser heating

    Wurster, S., Bigl, S., Cordill, M. J. & Kiener, D., 5 Jan 2017, In : Microelectronic engineering. 167, p. 110-118 9 p.

    Research output: Contribution to journalArticleResearchpeer-review

  3. Published

    Influence of extreme thermal cycling on metal-polymer interfaces

    Putz, B., Völker, B., Semprimoschnig, C. & Cordill, M. J., 5 Jan 2017, In : Microelectronic engineering. 167, p. 17-22 6 p.

    Research output: Contribution to journalArticleResearchpeer-review

  4. Published

    Buckle induced delamination techniques to measure the adhesion of metal dielectric interfaces

    Kleinbichler, A., Zechner, J. & Cordill, M., 2017, In : Microelectronic engineering. 167, p. 63-68

    Research output: Contribution to journalArticleResearchpeer-review

  5. 2002
  6. Published

    Numerical simulations of magneto transport in dot array systems at high magnetic fields

    Oswald, J., Ochiai, Y., Aoki, N., Lin, LH., Ishibashi, K., Aoyagi, Y., Bird, J. P. & Ferry, D. K., 2002, In : Microelectronic engineering. p. 91-95

    Research output: Contribution to journalArticleResearchpeer-review

  7. 1999
  8. Published

    A Networkmodel for the Hall Insulator

    Oswald, J., Homer, A. & Ganitzer, P., 1999, In : Microelectronic engineering. 47, p. 31-33

    Research output: Contribution to journalArticleResearchpeer-review

  9. Published

    Separation of Universal and Non-Universal Scaling Regions in the IQHE

    Meisels, R., Kuchar, F., Belitsch, W. & Kramer, B., 1999, In : Microelectronic engineering. 47, p. 23-25

    Research output: Contribution to journalArticleResearchpeer-review