Microelectronics Reliability, 0026-2714

Journal

ISSNs0026-2714

Research output

  1. 2017
  2. Published

    Influence of cooling rate and annealing on the DSC Tg of an epoxy resin

    Tao, Q., Pinter, G. & Krivec, T., 1 Nov 2017, In : Microelectronics Reliability. 78, p. 396-400 5 p.

    Research output: Contribution to journalArticleResearchpeer-review

  3. 2016
  4. Published

    Numerical simulation of the electrical performance of printed circuit boards under cyclic thermal loads

    Fellner, K., Antretter, T., Fuchs, P. F. & Tao, Q., 2016, In : Microelectronics Reliability. p. 148-155

    Research output: Contribution to journalArticleResearchpeer-review

  5. Published

    The effect of bending loading conditions on the reliability of inkjet printed and evaporated silver metallization on polymer substrates

    Glushko, O., Cordill, M., Klug, A. & List-Kratochvil, E. J. W., 2016, In : Microelectronics Reliability.

    Research output: Contribution to journalArticleResearchpeer-review

  6. 2013
  7. Published

    PCB drop test lifetime assessment based on simulations and cyclic bend tests

    Fuchs, P., Pinter, G. & Major, Z., 2013, In : Microelectronics Reliability. 53, p. 774-781

    Research output: Contribution to journalArticleResearchpeer-review

  8. 2012
  9. Published

    Determination of the orthotropic material properties of individual layers of printed circuit boards

    Fuchs, P. F., Pinter, G. & Tonejc, M., 2012, In : Microelectronics Reliability. 52, 11, p. 2723-2730

    Research output: Contribution to journalArticleResearchpeer-review