Daniel Kiener

Activities

  1. 2021
  2. Combining high strength, ductility and toughness in interface-doped W-Cu nanocomposites

    Daniel Kiener (Invited speaker), Michael Wurmshuber (Speaker), Klemens Silvester Schmuck (contributor), Inas Issa (contributor) & Michael Burtscher (contributor)

    3 Dec 2021

    Activity: Talk or presentation Oral presentation

  3. Combining high strength, ductility and toughness in interface-doped W-Cu nanocomposites

    Daniel Kiener (Invited speaker), A. Massone (Speaker), Armin Manhart (contributor), Wolfgang Jacob (contributor), Andreas Drexler (contributor) & Werner Ecker (contributor)

    29 Nov 2021

    Activity: Talk or presentation Oral presentation

  4. Combining high strength, ductility and toughness in interface-doped W-Cu nanocomposites

    Daniel Kiener (Invited speaker), Michael Wurmshuber (Speaker), Simon Doppermann (contributor), Markus Alfreider (contributor), Inas Issa (contributor), Klemens Silvester Schmuck (contributor), Michael Burtscher (contributor), Stefan Wurster (contributor), Severin Jakob (contributor), Rishi Bodlos (contributor), Lorenz Romaner (contributor), Christoph Gammer (contributor), Verena Maier-Kiener (contributor) & Helmut Clemens (contributor)

    29 Nov 2021

    Activity: Talk or presentation Oral presentation

  5. Thomas Edwards

    Daniel Kiener (Host)

    1 Nov 202131 Aug 2022

    Activity: Hosting a visitorHosting an academic visitor

  6. How grain boundary doping affects the mechanical properties in ultra-fine grained tungsten and nanocrystalline tungsten composites

    Michael Wurmshuber (Speaker), Simon Doppermann (contributor), Stefan Wurster (contributor), Severin Jakob (contributor), Markus Alfreider (contributor), Klemens Silvester Schmuck (contributor), Rishi Bodlos (contributor), Lorenz Romaner (contributor), Verena Maier-Kiener (contributor), Helmut Clemens (contributor) & Daniel Kiener (contributor)

    29 Sep 2021

    Activity: Talk or presentation Oral presentation

  7. Combining high strength, ductility and toughness in interface-doped W-Cu nanocomposites

    Michael Wurmshuber (Speaker), Klemens Silvester Schmuck (contributor), Simon Doppermann (contributor), Michael Burtscher (contributor), Rishi Bodlos (contributor), Lorenz Romaner (contributor) & Daniel Kiener (contributor)

    17 Sep 2021

    Activity: Talk or presentation Oral presentation

  8. Fracture of distinct interfaces: In-situ observations vs. stiffness approaches

    Inas Issa (contributor), Christoph Gammer (contributor), Stefan Kolitsch (contributor), Anton Hohenwarter (contributor), Peter Julian Imrich (contributor), Reinhard Pippan (contributor) & Daniel Kiener (Invited speaker)

    17 Sep 2021

    Activity: Talk or presentation Oral presentation

  9. Impact of grain size on the fracture toughness for tungsten-copper nanocomposites

    Klemens Silvester Schmuck (Speaker), Markus Alfreider (contributor) & Daniel Kiener (contributor)

    16 Sep 2021

    Activity: Talk or presentation Oral presentation

  10. Linking the ‘hardening by annealing’ phenomenon with grain boundary relaxation in HPT processed tantalum

    Markus Alfreider (Speaker), Inas Issa (contributor), O. Renk (contributor) & Daniel Kiener (contributor)

    16 Sep 2021

    Activity: Talk or presentation Oral presentation

  11. Locally resolved interfacial fracture mechanics in a Si-WTi-Cu multilayer system

    Markus Alfreider (Speaker), Rishi Bodlos (contributor), Lorenz Romaner (contributor) & Daniel Kiener (contributor)

    16 Sep 2021

    Activity: Talk or presentation Oral presentation

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