Thomas Antretter
Research output
- 2021
- Published
Liquid Metal Embrittlement of Advanced High Strength Steel: Experiments and damage modeling
Prabitz, K. M., Asadzadeh, M. Z., Pichler, M., Antretter, T., Beal, C., Schubert, H., Hilpert, B., Gruber, M., Sierlinger, R. & Ecker, W., 21 Sep 2021, In: Materials. 14.2021, 18, 15 p., 5451.Research output: Contribution to journal › Article › Research › peer-review
- Published
Validated multi-physical finite element modelling of the spot welding process of the advanced high strength steel dp1200hd
Prabitz, K., Pichler, M., Antretter, T., Schubert, H., Hilpert, B., Gruber, M., Sierlinger, R. & Ecker, W., 18 Sep 2021, In: Materials. 14.2021, 18, 19 p., 5411.Research output: Contribution to journal › Article › Research › peer-review
- Published
Ductile failure modelling in pre-cracked solids using coupled fracture locus theory
Baltic, S., Magnien, J., Kolitsch, S., Gänser, H-P., Antretter, T. & Hammer, R., Jul 2021, In: Engineering Fracture Mechanics. 252.2021, July, 13 p., 107845.Research output: Contribution to journal › Article › Research › peer-review
- Published
MUL 4.0 – Digitalisierung der Wertschöpfungskette vom Rohmaterial bis hin zum Recycling
Woschank, M., Ralph, B. J., Kaiblinger, A., Miklautsch, P., Pacher, C., Sorger, M., Zsifkovits, H., Stockinger, M., Pogatscher, S., Antretter, T. & Antrekowitsch, H., 2 Jun 2021, In: Berg- und hüttenmännische Monatshefte : BHM. 166, 6, p. 309-313Research output: Contribution to journal › Article › Research › peer-review
- Published
Evaluation of Cement-Casing & Cement-Rock Bond Integrity during Well Operations.
Lamik, A., Thonhauser, G., Ravi, K., Prohaska-Marchried, M., Pittino, G. & Antretter, T., 27 May 2021, p. 1-13. 13 p.Research output: Contribution to conference › Paper › peer-review
- Published
Machine learning assisted calibration of a ductile fracture locus model
Baltic, S., Asadzadeh, M. Z., Hammer, P., Magnien, J., Gänser, H. P., Antretter, T. & Hammer, R., May 2021, In: Materials and Design. 203.2021, May, 15 p., 109604.Research output: Contribution to journal › Article › Research › peer-review
- Published
Electro-Thermo-Mechanical Reliability Assessment of Arbitrary Power Electronics
Gschwandl, M., Pfost, M., Antretter, T., Fuchs, P. F., Mitev, I., Tao, Q. & Schingale, A., 19 Apr 2021, 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021. Institute of Electrical and Electronics Engineers, 9410862. (2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
- Published
Prediction of Curing Induced Residual Stresses in Polymeric Encapsulation Materials for Microelectronics
Schipfer, C., Gschwandl, M., Fuchs, P., Antretter, T., Feuchter, M., Morak, M., Tao, Q. & Schingale, A., 19 Apr 2021, 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021. Institute of Electrical and Electronics Engineers, 9410855. (2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
- Published
Thermal and Moisture Dependent Material Characterization and Modeling of Glass Fibre Reinforced Epoxy Laminates
Yalagach, M., Fuchs, P., Antretter, T., Feuchter, M., Tao, Q. & Weber, M., 29 Jan 2021, In: Sensors & transducers. 248.2021, 1, 9 p.Research output: Contribution to journal › Article › Research › peer-review
- 2020
- Published
Numerical analysis of a MEMS sensor's deformation behavior considering dynamic moisture conditions
Yalagach, M., Fuchs, P. F., Antretter, T., Qi, T. & Weber, M., 2 Dec 2020, 2020 IEEE 22nd Electronics Packaging Technology Conference, EPTC 2020. Institute of Electrical and Electronics Engineers, p. 380-385 6 p. 9315091. (2020 IEEE 22nd Electronics Packaging Technology Conference, EPTC 2020).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution