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Velislava Terziyska
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Velislava Terziyska
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Chair of Functional Materials and Materials Systems
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4231; 4232
Latest Research Output
Microstructural Effects on the Interfacial Adhesion of Nanometer-Thick Cu Films on Glass Substrates: Implications for Microelectronic Devices
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Improved electro-mechanical reliability of flexible systems with alloyed Mo-Ta adhesion layers
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peer-review
Evolution of the microstructure of sputter deposited TaAlON thin films with increasing oxygen partial pressure
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peer-review
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