Au–Sn solders applied in transient liquid phase bonding: Microstructure and mechanical behavior

Research output: Contribution to journalArticleResearchpeer-review

External Organisational units

  • Max-Planck-Institut für Eisenforschung GmbH
  • RWTH Aachen
  • Infineon Technologies AG Austria
  • KAI - Kompetenzzentrum Automobil- und Industrieelektronik GmbH
  • Erich Schmid Institute of Materials Science

Details

Original languageEnglish
Article number100503
JournalMaterialia
Volume8
DOIs
Publication statusPublished - 1 Dec 2019