Copper/epoxy joints in printed circuit boards: Manufacturing and interfacial failure mechanisms

Research output: Contribution to journalReview articlepeer-review

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Copper/epoxy joints in printed circuit boards : Manufacturing and interfacial failure mechanisms. / Nothdurft, Philipp; Riess, Gisbert; Kern, Wolfgang.

In: Materials, Vol. 12, No. 3, 550, 12.02.2019.

Research output: Contribution to journalReview articlepeer-review

Bibtex - Download

@article{abd101b5852b4c628e06e26a5fdf4f5e,
title = "Copper/epoxy joints in printed circuit boards: Manufacturing and interfacial failure mechanisms",
keywords = "Circuit boards, Copper/epoxy joints, Electronic industry, Failure analysis, Printed, State of the art",
author = "Philipp Nothdurft and Gisbert Riess and Wolfgang Kern",
year = "2019",
month = feb,
day = "12",
doi = "10.3390/ma12030550",
language = "English",
volume = "12",
journal = "Materials",
issn = "1996-1944",
publisher = "Multidisciplinary Digital Publishing Institute (MDPI)",
number = "3",

}

RIS (suitable for import to EndNote) - Download

TY - JOUR

T1 - Copper/epoxy joints in printed circuit boards

T2 - Manufacturing and interfacial failure mechanisms

AU - Nothdurft, Philipp

AU - Riess, Gisbert

AU - Kern, Wolfgang

PY - 2019/2/12

Y1 - 2019/2/12

KW - Circuit boards

KW - Copper/epoxy joints

KW - Electronic industry

KW - Failure analysis

KW - Printed

KW - State of the art

UR - http://www.scopus.com/inward/record.url?scp=85061484759&partnerID=8YFLogxK

U2 - 10.3390/ma12030550

DO - 10.3390/ma12030550

M3 - Review article

AN - SCOPUS:85061484759

VL - 12

JO - Materials

JF - Materials

SN - 1996-1944

IS - 3

M1 - 550

ER -