Influence of environmental factors like temperature and humidity on MEMS packaging materials.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Organisational units

External Organisational units

  • Polymer Competence Center Leoben GmbH
  • Austria-Mikro-Syst.-Intl. GmbH
  • Austria Technologie Systemtechnik Aktiengesellschaft

Details

Original languageEnglish
Title of host publication2018 7th Electronic System-Integration Technology Conference, ESTC 2018 - Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781538668139
DOIs
Publication statusPublished - 26 Nov 2018
Event7th Electronic System-Integration Technology Conference, ESTC 2018 - Dresden, Germany
Duration: 18 Sep 201821 Sep 2018

Conference

Conference7th Electronic System-Integration Technology Conference, ESTC 2018
CountryGermany
CityDresden
Period18/09/1821/09/18