Microstructural Effects on the Interfacial Adhesion of Nanometer-Thick Cu Films on Glass Substrates: Implications for Microelectronic Devices

Research output: Contribution to journalArticleResearchpeer-review

Authors

  • Alice Lassnig
  • Daniel M. Toebbens
  • Reinhard Pippan
  • Megan J. Cordill

External Organisational units

  • Österreichische Akademie der Wissenschaften
  • Helmholtz-Zentrum Berlin für Materialien und Energie (HZB)

Details

Original languageEnglish
Pages (from-to)61-70
Number of pages10
JournalACS Applied Nano Materials
Volume4.2021
Issue number1
DOIs
Publication statusPublished - 28 Dec 2020