Multi-physics simulation of the component attachment within embedding process

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Authors

External Organisational units

  • Materials Center Leoben Forschungs GmbH

Details

Original languageEnglish
Title of host publication14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1-6
Number of pages6
ISBN (Print)978-1-4673-6138-5
DOIs
Publication statusPublished - 1 Apr 2013
EventEuroSimE 2013 - Wroclaw, Poland
Duration: 15 Apr 201317 Apr 2013

Conference

ConferenceEuroSimE 2013
Abbreviated titleEuroSimE 2013
CountryPoland
CityWroclaw
Period15/04/1317/04/13