Numerical analysis of the influence of polymeric materials on a MEMS package performance under humidity and temperature loads

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Organisational units

External Organisational units

  • Polymer Competence Center Leoben GmbH
  • Austria-Mikro-Syst.-Intl. GmbH
  • AT and S AG

Details

Original languageEnglish
Title of host publicationProceedings - IEEE 69th Electronic Components and Technology Conference, ECTC 2019
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages2029-2035
Number of pages7
ISBN (Electronic)9781728114989
ISBN (Print)9781728114989
DOIs
Publication statusPublished - 1 May 2019
Event69th IEEE Electronic Components and Technology Conference, ECTC 2019 - Las Vegas, United States
Duration: 28 May 201931 May 2019

Publication series

Name2019 IEEE 69TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC)
ISSN (Print)0569-5503

Conference

Conference69th IEEE Electronic Components and Technology Conference, ECTC 2019
CountryUnited States
CityLas Vegas
Period28/05/1931/05/19