Prediction of Curing Induced Residual Stresses in Polymeric Encapsulation Materials for Microelectronics

Research output: Chapter in Book/Report/Conference proceedingConference contribution

External Organisational units

  • Polymer Competence Center Leoben GmbH
  • Austria Technologie Systemtechnik Aktiengesellschaft
  • Vitesco Technologies

Details

Original languageEnglish
Title of host publication2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781665413732
ISBN (Print)9781665413732
DOIs
Publication statusPublished - 19 Apr 2021
Event22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021 - St. Julian, Malta
Duration: 19 Apr 202121 Apr 2021

Publication series

Name2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021

Conference

Conference22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021
CountryMalta
CitySt. Julian
Period19/04/2121/04/21