Research output

  1. 2021
  2. Published

    Liquid Metal Embrittlement of Advanced High Strength Steel: Experiments and damage modeling

    Prabitz, K. M., Asadzadeh, M. Z., Pichler, M., Antretter, T., Beal, C., Schubert, H., Hilpert, B., Gruber, M., Sierlinger, R. & Ecker, W., 21 Sep 2021, In: Materials. 14.2021, 18, 15 p., 5451.

    Research output: Contribution to journalArticleResearchpeer-review

  3. Published

    Validated multi-physical finite element modelling of the spot welding process of the advanced high strength steel dp1200hd

    Prabitz, K., Pichler, M., Antretter, T., Schubert, H., Hilpert, B., Gruber, M., Sierlinger, R. & Ecker, W., 18 Sep 2021, In: Materials. 14.2021, 18, 19 p., 5411.

    Research output: Contribution to journalArticleResearchpeer-review

  4. Published

    Ductile failure modelling in pre-cracked solids using coupled fracture locus theory

    Baltic, S., Magnien, J., Kolitsch, S., Gänser, H-P., Antretter, T. & Hammer, R., Jul 2021, In: Engineering Fracture Mechanics. 252.2021, July, 13 p., 107845.

    Research output: Contribution to journalArticleResearchpeer-review

  5. Published
  6. Published

    Evaluation of Cement-Casing & Cement-Rock Bond Integrity during Well Operations.

    Lamik, A., Thonhauser, G., Ravi, K., Prohaska-Marchried, M., Pittino, G. & Antretter, T., 27 May 2021, p. 1-13. 13 p.

    Research output: Contribution to conferencePaperResearchpeer-review

  7. Published

    Machine learning assisted calibration of a ductile fracture locus model

    Baltic, S., Asadzadeh, M. Z., Hammer, P., Magnien, J., Gänser, H. P., Antretter, T. & Hammer, R., May 2021, In: Materials and Design. 203.2021, May, 15 p., 109604.

    Research output: Contribution to journalArticleResearchpeer-review

  8. Published

    Electro-Thermo-Mechanical Reliability Assessment of Arbitrary Power Electronics

    Gschwandl, M., Pfost, M., Antretter, T., Fuchs, P. F., Mitev, I., Tao, Q. & Schingale, A., 19 Apr 2021, 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021. Institute of Electrical and Electronics Engineers, 9410862. (2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021).

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

  9. Published

    Prediction of Curing Induced Residual Stresses in Polymeric Encapsulation Materials for Microelectronics

    Schipfer, C., Gschwandl, M., Fuchs, P., Antretter, T., Feuchter, M., Morak, M., Tao, Q. & Schingale, A., 19 Apr 2021, 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021. Institute of Electrical and Electronics Engineers, 9410855. (2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021).

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

  10. Published

    Thermal and Moisture Dependent Material Characterization and Modeling of Glass Fibre Reinforced Epoxy Laminates

    Yalagach, M., Fuchs, P., Antretter, T., Feuchter, M., Tao, Q. & Weber, M., 29 Jan 2021, In: Sensors & transducers. 248.2021, 1, 9 p.

    Research output: Contribution to journalArticleResearchpeer-review

  11. 2020
  12. Published

    Numerical analysis of a MEMS sensor's deformation behavior considering dynamic moisture conditions

    Yalagach, M., Fuchs, P. F., Antretter, T., Qi, T. & Weber, M., 2 Dec 2020, 2020 IEEE 22nd Electronics Packaging Technology Conference, EPTC 2020. Institute of Electrical and Electronics Engineers, p. 380-385 6 p. 9315091. (2020 IEEE 22nd Electronics Packaging Technology Conference, EPTC 2020).

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

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