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  1. 2021
  2. Published

    RESIN COMPOSITION SUITABLE FOR PRINTING AND PRINTING METHODS

    Edler, M., Hartmann, D. G. & Grießer, T., 26 Mar 2021, Patent No. IN202117002811

    Research output: Patent

  3. Published

    Self-Reducing Silver Ink on Polyurethane Elastomers for the Manufacture of Thin and Highly Stretchable Electrical Circuits

    Krawczyk, K. K., Groten, J., Glushko, O., Krivec, M., Frühwirth, M., Schulz, G., Wolf, C., Hartmann, D., Moser, M., Cordill, M. J., Stadlober, B. & Griesser, T., 22 Mar 2021, In: Chemistry of materials. 33.2021, 8, p. 2742-2755 14 p.

    Research output: Contribution to journal › Article › Research › peer-review

  4. Published

    Synthesis of bulk reactive Ni-Al composites using high pressure torsion

    Renk, O., Tkadletz, M., Kostoglou, N., Gunduz, I. E., Fezzaa, K., Sun, T., Stark, A., Doumanidis, C. C., Eckert, J., Pippan, R., Mitterer, C. & Rebholz, C., 15 Mar 2021, In: Journal of alloys and compounds. 857.2021, 15 March, 11 p., 157503.

    Research output: Contribution to journal › Article › Research › peer-review

  5. Published

    Ink Composition, kit, method of manufacturing a deformable conductor utilizing the ink composition, deformable conductor and electronic device comprising the

    Thomas, G. & Krzysztof, K. K., 24 Feb 2021, IPC No. H05K 3/ 12 A I, Patent No. GB2586450, Priority date 12 Aug 2019, Priority No. GB20190011512

    Research output: Patent

  6. Published

    INK COMPOSITION, KIT, METHOD OF MANUFACTURING A DEFORMABLE CONDUCTOR UTILIZING THE INK COMPOSITION, DEFORMABLE CONDUCTOR, ELECTRONIC DEVICE COMPRISING THE DEFORMABLE CONDUCTOR, METHOD OF MANUFACTURING A CONDUCTOR, CONDUCTOR AND ELECTRONIC DEVICE COMPRISING THE CONDUCTOR

    Griesser, T. & Krawczyk, K. K., 18 Feb 2021, IPC No. C09D 11/ 52 A I, Patent No. WO2021028394, Priority date 12 Aug 2019, Priority No. GB20190011512

    Research output: Patent

  7. Published

    INK COMPOSITION, KIT, METHOD OF MANUFACTURING A DEFORMABLE CONDUCTOR UTILIZING THE INK COMPOSITION, DEFORMABLE CONDUCTOR, ELECTRONIC DEVICE COMPRISING THE DEFORMABLE CONDUCTOR, METHOD OF MANUFACTURING A CONDUCTOR, CONDUCTOR AND ELECTRONIC DEVICE COMPRISING THE CONDUCTOR

    Griesser, T. & Krawczyk, K. K., 18 Feb 2021, IPC No. C09D 11/ 52 A I, Patent No. CA3147823, Priority date 10 Aug 2020, Priority No. WO2020EP72404

    Research output: Patent

  8. Published

    Adhesion evaluation of thin films to dielectrics in multilayer stacks: A comparison of four-point bending and stressed overlayer technique.

    Lassnig, A., Putz, B., Hirn, S., Többens, D., Mitterer, C. & Cordill, M. J., 15 Feb 2021, In: Materials and Design. 200, 15 February, 8 p., 109451.

    Research output: Contribution to journal › Article › Research › peer-review

  9. Published

    Resin composition suitable for printing and printing methods

    GRIEßER, T., Edler, M., Hartmann, D. G. & Oesterreicher, A. B., 11 Feb 2021, IPC No. C09D 11/ 101 A I, Patent No. AU2019304036, Priority date 18 Jul 2019, Priority No. WO2019EP69338

    Research output: Patent

  10. Published

    Ion irradiation-induced localized stress relaxation in W thin film revealed by cross-sectional X-ray nanodiffraction

    Hlushko, K., Mackova, A., Zalesak, J., Burghammer, M., Davydok, A., Krywka, C., Daniel, R., Keckes, J. & Todt, J., 7 Feb 2021, In: Thin solid films. 722.2021, 31 March, 6 p., 138571.

    Research output: Contribution to journal › Article › Research › peer-review

  11. E-pub ahead of print

    Improved electro-mechanical reliability of flexible systems with alloyed Mo-Ta adhesion layers

    Kreiml, P., Rausch, M., Terziyska, V., Köstenbauer, H., Winkler, J., Mitterer, C. & Cordill, M. J., 9 Jan 2021, (E-pub ahead of print) In: Thin solid films. 720.2021, 28 February, 9 p., 138533.

    Research output: Contribution to journal › Article › Research › peer-review

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