Research output

  1. 2021
  2. Published

    Microstructural effects on the interfacial adhesion of nanometer- thick Cu films on glass substrates: Implications for microelectronic devices

    Lassnig, A., Terziyska, V., Zalesak, J., Jörg, T., Többens, D., Griesser, T., Mitterer, C., Pippan, R. & Cordill, M., 2021, In: ACS Applied Nano Materials. 2021, 4, p. 61-70

    Research output: Contribution to journalArticleResearchpeer-review

  3. 2020
  4. Published

    Sputter deposition of NiW films from a rotatable target

    Rausch, M., Golizadeh Najafabadi, M., Kreiml, P., Cordill, M., Winkler, J. & Mitterer, C., 2020, In: Applied surface science. p. 145616 1-7

    Research output: Contribution to journalArticleResearchpeer-review

  5. 2019
  6. Published

    Correlation of mechanical damage and electrical behavior of Al/Mo bilayers subjected to bending

    Kreiml, P., Rausch, M., Terziyska, V. L., Köstenbauer, H., Winkler, J., Mitterer, C. & Cordill, M. J., 1 Oct 2019, In: Thin solid films. 687, 137480.

    Research output: Contribution to journalArticleResearchpeer-review

  7. Published

    Compressive and tensile bending of sputter deposited Al/Mo bilayers

    Kreiml, P., Rausch, M., Terziyska, V., Winkler, J., Mitterer, C. & Cordill, M., 15 Mar 2019, In: Scripta materialia. 162.2019, March, p. 367-371 5 p.

    Research output: Contribution to journalArticleResearchpeer-review

  8. 2018
  9. E-pub ahead of print

    In-situ observations of the fracture and adhesion of Cu/Nb multilayers on polyimide substrates

    Cordill, M., Kleinbichler, A., Völker, B., Kraker, P., Economy, D. R., Többens, D. M., Kirchlechner, C. & Kennedy, M. S., 14 Aug 2018, (E-pub ahead of print) In: Materials science and engineering: A, Structural materials: properties, microstructure and processing. 735.2018, 26 September, p. 456-462 7 p.

    Research output: Contribution to journalArticleResearchpeer-review

  10. Published

    Crack Initiation of Printed Lines Predicted with Digital Image Correlation

    Katsarelis, C., Glushko, O., Tonkin, C., Kennedy, M. S. & Cordill, M., 13 Jun 2018, In: JOM. 70.2018, 9, p. 1805-1810 6 p.

    Research output: Contribution to journalArticleResearchpeer-review

  11. Published

    Inkjet Printed Wiring Boards with Vertical Interconnect Access on Flexible, Fully Compostable Cellulose Substrates

    Samusjew, A., Lassnig, A., Cordill, M. J., Krawczyk, K. & Grießer, T., 1 Apr 2018, In: Advanced Materials Technologies. 3, 4, 1700250.

    Research output: Contribution to journalArticleResearchpeer-review

  12. Published

    Electrically reversible cracks in an intermetallic film controlled by an electric field

    Liu, Z. Q., Liu, J. H., Biegalski, M. D., Hu, J-M., Shang, S. L., Ji, Y., Wang, J. M., Hsu, S. L., Wong, A. T., Cordill, M., Gludovatz, B., Marker, C., Yan, H., Feng, Z. X., You, L., Lin, M. W., Ward, T. Z., Liu, Z. K., Jiang, C. B., Chen, L. Q., Ritchie, R. O., Christen, H. M. & Ramesh, R., 3 Jan 2018, In: Nature Communications. 41.2018, 9, 7 p., 9.

    Research output: Contribution to journalArticleResearchpeer-review

  13. Published

    Adhesion of critical interfaces in microelectronics

    Kleinbichler, A., 2018

    Research output: ThesisDoctoral Thesis

  14. Published

    Electro-mechanical behavior of Al/Mo bilayers studied with in situ straining methods

    Kreiml, P., Rausch, M., Terziyska, V., Köstenbauer, H., Winkler, J., Mitterer, C. & Cordill, M., 2018, In: Thin solid films. p. 131-136

    Research output: Contribution to journalArticleResearchpeer-review

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